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Laurell Technologies WS-400 spin coater used to apply photoresist to the surface of a silicon wafer. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
One of the largest application areas is thin films, which can be produced on a piece of substrate by spin coating or dip-coating. Protective and decorative coatings, and electro-optic components can be applied to glass, metal and other types of substrates with these methods.
A range of thicknesses can be achieved by spin coating. Most commonly the thicknesses range from 1-200 μm. The main properties that affect the thickness of the film are viscosity and spin speed. The more viscous the solvent the thicker the film will be and the faster the wafer is spun the thinner the film will be.
A thin film is a layer of materials ranging from fractions ... Dip coating is similar to spin coating in that a liquid precursor or sol-gel precursor is deposited on ...
Layer-by-layer (LbL) deposition is a thin film fabrication technique. The films are formed by depositing alternating layers of complementary materials with wash steps in between. This can be accomplished by using various techniques such as immersion, spin, spray, electromagnetism, or fluidics. [1]
A simple cross-section schematic of the slot-die coating process. Slot-die coating is a coating technique for the application of solution, slurry, hot-melt, or extruded thin films onto typically flat substrates such as glass, metal, paper, fabric, plastic, or metal foils.
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Sputter coating in scanning electron microscopy is a sputter deposition process [clarification needed] to cover a specimen with a thin layer of conducting material, typically a metal, such as a gold/palladium (Au/Pd) alloy. A conductive coating is needed to prevent charging of a specimen with an electron beam in conventional SEM mode (high ...
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