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The test often reveals problems that occurred during assembly, such as defective components, improper component placement, and insulator defects that may cause inadvertent shorting or grounding to chassis, in turn, compromising electrical circuit quality and product safety. [2]
A chassis ground is a link between different metallic parts of a machine to ensure an electrical connection between them. [1] Examples include electronic instruments and motor vehicles. Usages
The publication describes requirements, levels and test methods to achieve immunity compliance of an electronic product. The purpose is to create a reproducible ground for product compliance and the standard defines: ranges, levels, test equipment, setups, procedures, calibrations, generator waveforms and general uncertainties.
An insulation resistance test (IR test) measures the electrical resistance of insulation by applying a voltage between two locations, and measuring the resultant current flow. Proper safety precautions must be taken when doing this test, such as exclusion zones, making sure no wires are exposed, and personal protective equipment is worn.
In electrical engineering, a dielectric withstand test (also pressure test, high potential test, hipot test, or insulation test) is an electrical safety test performed on a component or product to determine the effectiveness of its insulation. The test may be between mutually insulated sections of a part, or energized parts and ground.
Electrical equipment may be designed with a floating ground for one of several reasons. One is safety. For example, a low-voltage DC power supply, such as a mobile phone charger, is connected to the mains through a transformer of one type or another, and there is no direct electrical connection between the current return path on the low-voltage side and physical ground (earth).
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The role “ground” may be ambiguous in systems that isolate different kinds of grounds (typical isolated grounds are analog signal ground, digital signal ground, AC power ground, DC power ground, and chassis ground). If different kinds of ground paths are in separate paths in a connector, the analysis should treat them as separate signals.