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The inability to plasma etch copper called for a drastic rethinking of the metal patterning process and the result of this rethinking was a process referred to as an additive patterning, also known as a "Damascene" or "dual-Damascene" process by analogy to a traditional technique of metal inlaying. [citation needed]
Self-aligned via dual-damascene patterning. Self-aligned contact and via patterning is an established method for patterning multiple contacts or vias from a single lithographic feature. It makes use of the intersection of an enlarged feature resist mask and underlying trenches which are surrounded by a pre-patterned hardmask layer.
This led to the establishment of Spain's damascene industry. [8] Eusebio's eldest son Plácido Zuloaga eventually took over the workshop and directed its work away from armaments to the production of intricate decorative art works. [7] In the process, he mastered and improved the techniques of damascening [9] and trained more than two hundred ...
Damascene (pigeon) Damascus goat; John of Damascus (c. 676-749), Syrian Christian monk and priest; Materials technologies evoking the visual texture of Damascus steel: Damascening, of inlaying different metals into one another; Damask, a reversible figured fabric; Damascene patterning, a manufacturing process used to pattern copper into microchips
Recovery efforts were underway across the eastern U.S. after a powerful storm inundated communities with heavy rain and caused at least 13 deaths.
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
FlexFET is a planar, independently double-gated transistor with a damascene metal top gate MOSFET and an implanted JFET bottom gate that are self-aligned in a gate trench. . This device is highly scalable due to its sub-lithographic channel length; non-implanted ultra-shallow source and drain extensions; non-epi raised source and drain regions; and gate-last fl
(Reuters) - Meta Platforms on Wednesday said it has agreed to pay about $25 million to settle a lawsuit by President Donald Trump over the company's suspension of his accounts after the Jan. 6 ...