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Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
As of 2020, the x86 architecture is used in most high end compute-intensive computers, including cloud computing, servers, workstations, and many less powerful computers, including personal computer desktops and laptops.
Intel's second generation of 32-bit x86 processors, introduced built-in floating point unit (FPU), 8 KB on-chip L1 cache, and pipelining. Faster per MHz than the 386. Small number of new instructions. P5 original Pentium microprocessors, first x86 processor with super-scalar architecture and branch prediction. P6
Co-processor Intel Knights Corner Xeon Phi board design. Reference unknown. 2012 Cherryville SSD Intel 520 series solid-state drives, 25 nm MLC, SATA 6 Gbit/s. Successor to Elmcrest. [13] Reference unknown. 2011 Chevelon: I/O processor Intel IOP341 and IOP342 I/O processors, built around the XScale architecture. Probably named after a place in ...
List of Intel Xeon processors.
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA) CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x; Package size: 37.5 mm × 37.5 mm; Steppings: B0; TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
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