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There are three major requirements of creating a desirable surface for adhesive bonding of plastics: the weak boundary layer of the given material must be removed or chemically modified to create a strong boundary layer; the surface energy of the adherend should be higher than the surface energy of the adhesive for good wetting; and the surface profile can be improved to provide mechanical ...
With the growing use of bonding technology in industry and professional trades, and the resulting, increasing demands on the quality and durability of glued products, comprehensive national and international standards have been developed for, amongst other things, the characterisation, classification and testing of adhesives and adhesive bonds.
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...
The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...
Anisotropic conductive film (ACF) is an adhesive interconnect system that is commonly used in panel display manufacturing, including liquid crystal displays (LCD) and organic light-emitting diode (OLED) technology. In display manufacturing, ACF facilitates the electrical and mechanical connections between the driver electronics and substrates.
Liquid optically-clear adhesive (LOCA) is liquid-based bonding technology used in touch panels and display devices to bind the cover lens, plastic, or other optical materials to the main sensor unit or each other. These adhesives improve optical characteristics and durability. LOCA glue is often hardened using ultraviolet light.
Wafer bond characterization refers to the process of evaluating the quality and strength of a bond between two semiconductor wafers. The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws.
Drawing of a tape-automated bonding carrier and definitions of various parts of the TAB assembly. Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.