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  2. IPC (electronics) - Wikipedia

    en.wikipedia.org/wiki/IPC_(electronics)

    IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

  3. Integrated passive devices - Wikipedia

    en.wikipedia.org/wiki/Integrated_passive_devices

    Today portable electronic systems include roughly 2–40 discrete passive devices/integrated circuit or module. [18] This shows that monolithic or module integration is not capable to include all functionality based on passive components in system realisations, and variety of technologies is needed to minimize logistics and system size.

  4. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card. A PCB may be printed with a legend identifying the components, test points, or identifying

  5. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    IEEE 200-1975 or "Standard Reference Designations for Electrical and Electronics Parts and Equipments" is a standard that was used to define referencing naming systems for collections of electronic equipment. IEEE 200 was ratified in 1975. The IEEE renewed the standard in the 1990s, but withdrew it from active support shortly thereafter.

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to ...

  7. printed circuit board (PCB) – a board that supports electrical or electronic components and connects them with etched traces and pads; quilt packaging – a technology that makes electrically and mechanically robust chip-to-chip interconnections by using horizontal structures at the chip edges

  8. IDC (electrical connector) - Wikipedia

    en.wikipedia.org/wiki/IDC_(electrical_connector)

    An insulation-displacement contact (IDC), also known as insulation-piercing contact (IPC), is an electrical connector designed to be connected to the conductor(s) of an insulated cable by a connection process which forces a selectively sharpened blade or blades through the insulation, bypassing the need to strip the conductors of insulation ...

  9. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.