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  2. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    A WL-CSP or WLCSP package is just a bare die with a redistribution layer (or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package. [19] PMCP: Power mount CSP (chip-scale package) Variation of WLCSP, for power devices like MOSFETs.

  4. Power MOSFET - Wikipedia

    en.wikipedia.org/wiki/Power_MOSFET

    IRLZ24N Power MOSFET in a TO-220AB through-hole package. Pins from left to right are: gate (logic-level), drain, source. The top metal tab is the drain, same as pin 2. [1]A power MOSFET is a specific type of metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels.

  5. Multi-leaded power package - Wikipedia

    en.wikipedia.org/wiki/Multi-leaded_power_package

    Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply ...

  6. TO-92 - Wikipedia

    en.wikipedia.org/wiki/TO-92

    Transistors and ICs of these types cannot handle as much power as higher-power equivalents, such as the TO-220, and can burn out quickly if they dissipate excessive power. There is no standard pinout for the TO-92. The American BJTs use the E-B-C pinout while their Japanese counterparts use the E-C-B pinout and some RF devices use the B-E-C pinout.

  7. TO-3 - Wikipedia

    en.wikipedia.org/wiki/TO-3

    Size comparison of BJT transistor packages, from left to right: SOT-23, TO-92, TO-126, TO-3 3D model of TO-3 package. In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits.

  8. The best home elevators of 2025, according to mobility experts

    www.aol.com/lifestyle/best-home-elevators...

    It’s energy efficient and plugs into a regular 110- or 220-volt power outlet, and it can typically be installed in one day, so you’ll have an elevator up and running with minimal inconvenience ...

  9. TO-263 - Wikipedia

    en.wikipedia.org/wiki/TO-263

    [1] [2] They are similar to the earlier TO-220-style packages intended for high power dissipation [2] [4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can ...

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