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  2. Wire shelving - Wikipedia

    en.wikipedia.org/wiki/Wire_shelving

    The most common shelf size is 42 inches deep by 46 inches wide, while two such shelves placed side-by-side can usually be combined to allow for a single shelf of 8 feet wide. The weight capacity of a 42x46 shelf ranges from 2,000 to 3,500 pounds, while the decking itself weighs from 24 to 30 pounds.

  3. Category 5 cable - Wikipedia

    en.wikipedia.org/wiki/Category_5_cable

    Cross section of a cat 5e cable. The Category 5e specification improves upon the Category 5 specification by further mitigating crosstalk. [9] The bandwidth (100 MHz) and physical construction are the same between the two, [10] and most Cat 5 cables actually happen to meet Cat 5e specifications even though they are not certified as such. [11]

  4. Flip-flop (electronics) - Wikipedia

    en.wikipedia.org/wiki/Flip-flop_(electronics)

    The term flip-flop has historically referred generically to both level-triggered (asynchronous, transparent, or opaque) and edge-triggered (synchronous, or clocked) circuits that store a single bit of data using gates. [1] Modern authors reserve the term flip-flop exclusively for edge-triggered storage elements and latches for level-triggered ones.

  5. Flip-top - Wikipedia

    en.wikipedia.org/wiki/Flip-top

    A precursor to the flip-top, the "bail" or "Kilner" closure was invented in 1859, where a lid with gasket was held by a wire harness and sealed by a separate set of wires. Examples of flip-top bottles. The first flip-top closure was created by Charles de Quillfeldt in the United States, who filed for a patent on 30 November 1874.

  6. Ground-level power supply - Wikipedia

    en.wikipedia.org/wiki/Ground-level_power_supply

    Seville Tram equipped with CAF ACR ground-level power supply, 2019. Ground-level power supply, also known as surface current collection or, in French, alimentation par le sol ("feeding via the ground"), is a concept and group of technologies that enable electric vehicles to collect electric power at ground level instead of the more common overhead lines.

  7. Flip chip - Wikipedia

    en.wikipedia.org/wiki/Flip_chip

    Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

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