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  2. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Simplified diagram for electroplating copper (orange) on a conductive object (the cathode, "Me", gray). The electrolyte is a solution of copper sulfate, CuSO 4 in sulfuric acid. A copper anode is used to replenish the electrolyte with copper cations Cu 2+ as they are plated out at the cathode.

  3. Electrotyping - Wikipedia

    en.wikipedia.org/wiki/Electrotyping

    Schematic apparatus for electrotyping. An electric current flows from the battery, through the copper anode, the electrolyte, and the coated mold. A copper film (the electrotype) grows onto the electrically conducting coating of the mold. Electrotyping (also galvanoplasty) is a chemical method for forming metal parts that exactly reproduce a model.

  4. LIGA - Wikipedia

    en.wikipedia.org/wiki/LIGA

    LIGA consists of three main processing steps: lithography, electroplating, and molding. There are two main LIGA-fabrication technologies: X-Ray LIGA, which uses X-rays produced by a synchrotron to create high-aspect-ratio structures, and UV LIGA, a more accessible method which uses ultraviolet light to create structures with relatively low aspect ratios.

  5. Nickel electroplating - Wikipedia

    en.wikipedia.org/wiki/Nickel_electroplating

    Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]

  6. Copper electroplating - Wikipedia

    en.wikipedia.org/wiki/Copper_electroplating

    Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [ 1 ]

  7. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    PCB copper electroplating line in the process of pattern plating copper The two processing methods used to produce a double-sided PWB with plated-through holes. The process by which copper traces are applied to the surface is known as etching after the subtractive method of the process, though there are also additive and semi-additive methods.

  8. Process flow diagram - Wikipedia

    en.wikipedia.org/wiki/Process_flow_diagram

    A process flow diagram (PFD) is a diagram commonly used in chemical and process engineering to indicate the general flow of plant processes and equipment. The PFD displays the relationship between major equipment of a plant facility and does not show minor details such as piping details and designations.

  9. Electrogalvanization - Wikipedia

    en.wikipedia.org/wiki/Electrogalvanization

    Such Zinc electroplating or Zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot dip galvanizing and electroplating. [ 1 ]