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Laurell Technologies WS-400 spin coater used to apply photoresist to the surface of a silicon wafer. Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
There are four basic parameters that are involved in spin coating: solution viscosity, solid content (density), angular speed, and spin time. [13] A range of thicknesses can be achieved by spin coating. Most commonly the thicknesses range from 1-200 μm. The main properties that affect the thickness of the film are viscosity and spin speed.
The bilayers and wash steps can be performed in many different ways including dip coating, spin-coating, spray-coating, flow based techniques and electro-magnetic techniques. [1] The preparation method distinctly impacts the properties of the resultant films, allowing various applications to be realized. [ 1 ]
A schematic of a typical slot-die coating system. Slot-die coating equipment is available in a variety of configurations and form factors. However, the vast majority of slot-die processes are driven by a similar set of common core components. These include: A fluid reservoir to store the main supply of coating fluid for the system; A pump to ...
SU-8 molecule. SU-8 is a commonly used epoxy-based negative photoresist.Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development.
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The first self-cleaning glass was based on a thin film titania coating. [3] The film can be applied by spin coating of organo-titanate chelated precursor (for example titanium iso-tetrapropoxide chelated by acetylacetone), followed by heat treatment at elevated temperatures to burn the organic residues and to form the anatase phase.