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Equipotential bonding involves electrically connecting metalwork so that it is at the same voltage everywhere. Exact rules for electrical installations vary by country, locality, or supplying power company. [2] Equipotential bonding is done from where the distribution wiring enters the building to incoming water and gas services.
Compliant bonding is used to connect gold wires to electrical components such as integrated circuit "chips". It was invented by Alexander Coucoulas in the 1960s. [ 1 ] The bond is formed well below the melting point of the mating gold surfaces and is therefore referred to as a solid-state type bond.
Equipment bonding conductors or equipment ground conductors (EGC) provide a low-impedance path between normally non-current-carrying metallic parts of equipment and one of the conductors of that electrical system's source. If any exposed metal part should become energized (fault), such as by a frayed or damaged insulator, it creates a short ...
Metallic bonding is mostly non-polar, because even in alloys there is little difference among the electronegativities of the atoms participating in the bonding interaction (and, in pure elemental metals, none at all). Thus, metallic bonding is an extremely delocalized communal form of covalent bonding.
A bonding jumper is a reliable conductor to ensure the required electrical conductivity between metal raceways required to be electrically connected. [ 1 ] Wide metal bonding straps around the joints of a radio antenna mast.
In electrical engineering, ground and neutral (earth and neutral) are circuit conductors used in alternating current (AC) electrical systems. The neutral conductor receives and returns alternating current to the supply during normal operation of the circuit; to limit the effects of leakage current from higher-voltage systems, the neutral ...
WEEB or Washer Electrical Equipment Bond is a type of electrical component that allows the connection of various metals to a copper conductor.. Because of galvanic corrosion, dissimilar metals exposed to an electrolyte and electrically bonded together are unstable: the interface between the two materials will corrode one of them, and the structure will eventually fail.
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...