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In semiconductor manufacturing, a mask is sometimes called a reticle. [1] [2] ... A curvilinear photomask has patterns with curves, which is a departure from ...
Once the wafer and reticle are in place and aligned, the wafer stage, which is moved very precisely in the X and Y directions (front to back and left to right) by worm screws or linear motors, carries the wafer so that the first of the many patterns (or "shots") to be exposed on it is located below the lens, directly under the reticle.
Photolithography is the most common method for the semiconductor fabrication of integrated circuits ("ICs" or "chips"), such as solid-state memories and microprocessors. It can create extremely small patterns, down to a few nanometers in size. It provides precise control of the shape and size of the objects it creates.
An illustration of OPC (Optical Proximity Correction). The blue Γ-like shape is what chip designers would like printed on a wafer, in green is the pattern on a mask after applying optical proximity correction, and the red contour is how the shape actually prints on the wafer (quite close to the desired blue target).
Layout view of a simple CMOS operational amplifier. In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit.
Both wafers and reticles can be handled by SMIF pods in a semiconductor fabrication environment. Used in lithographic tools, reticles or photomasks contain the image that is exposed on a coated wafer in one processing step of a complete integrated semiconductor manufacturing cycle. Because reticles are linked so directly with wafer processing ...
A conventional photomask is a transparent plate with the same thickness everywhere, parts of which are covered with non-transmitting material in order to create a pattern on the semiconductor wafer when illuminated. In alternating phase-shift masks, certain transmitting regions are made thinner or thicker. That induces a phase-shift in the ...
Producing a reticle layout with test patterns and alignment marks. Layout-to-mask preparation that enhances layout data with graphics operations and adjusts the data to mask production devices. This step includes resolution enhancement technologies (RET), such as optical proximity correction (OPC) or inverse lithography technology (ILT).
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