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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
The 2N7002 variant is packaged in a TO-236 surface-mount package. The 2N7000 is an N-channel, enhancement-mode MOSFET used for low-power switching applications. [1] The 2N7000 is a widely available and popular part, often recommended as useful and common components to have around for hobbyist use. [2]
The JEDEC registered part numbers 1N914 and 1N4148 were originally only available in an axial package, but over time similar parts became available in surface-mount packages too. Through-hole package. 1N4148 in DO-35 glass axial package. [8] [9] [7] [10] [11] Surface-mount packages. LL4148 in MiniMELF package. [10] [12] [13] 1N4148W in SOD-123 ...
Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead. TAB: Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs. COG: Chip-on-glass
Top, left to right: circuit breaker, mercury switch, wafer switch, DIP switch, surface mount switch ... a thermostat is a temperature-operated switch used to control ...
When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used. High T g potting compounds may break solder bonds through solder fatigue by hardening at a higher temperature because the coating then shrinks as a rigid solid over a larger part ...
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