Search results
Results from the WOW.Com Content Network
A headphone interface (proprietary Siemens "Lumberg" socket) All devices weigh approximately 2.2 lb (1 kg) and measure 10.35 × 7.08 × 1.10 inches (263 mm ×181 mm × 30 mm). The SIMpad was initially released with the Handheld PC 2000 ( Windows CE 3.0) operating system, while later units (mostly SL4 and SLC) were released with Windows CE.NET ...
JT is the common interoperability format in use across all of Siemens Digital Industries Software and has been adopted as the long term data archival format across all of Siemens. On September 18, 2009, the ISO stated officially that the JT specification has been accepted for publication as an ISO Publicly Available Specification (PAS).
The structure of a PAD is defined by the ITU-T in recommendations X.3, X.28, and X.29. Sometimes, this is referred to as a Triple-X PAD, due to the three X-series recommendations which define it: X.3 specifies the parameters for terminal-handling functions such as line speed, flow control, character echo, et al. for a connection to an X.25 host.
[4] [5] By 1957 Frosch and Derick, using masking and predeposition, were able to manufacture silicon dioxide field effect transistors; the first planar transistors, in which drain and source were adjacent at the same surface. [6] They showed that silicon dioxide insulated, protected silicon wafers and prevented dopants from diffusing into the ...
Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...
The underside of a FC-PGA package (The die is on the other side.) A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed.
Integrates Zigbee (IEEE 802.15.4). It can be used with other 802.15.4 network standards as well as Zigbee. It is the same shape as the Duemilanove, includes an external RPSMA jack on the side of the board opposite the power jack, and is compatible with shields that work with other 3.3 V boards. EtherTen [122] ATmega328P Freetronics
Virtex is the flagship family of FPGA products currently developed by AMD, originally Xilinx before being acquired by the former. [1] Other current product lines include Kintex (mid-range) and Artix (low-cost), each including configurations and models optimized for different applications. [2]