Search results
Results from the WOW.Com Content Network
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).
Every time the temperature sensing network determines that a rise above the specified junction temperature (), is imminent, measures such as clock gating, clock stretching, clock speed reduction and others (commonly referred to as thermal throttling) are applied to prevent the temperature to raise further. If the applied mechanisms are not ...
GPU Boost is a new feature which is roughly analogous to turbo boosting of a CPU. The GPU is always guaranteed to run at a minimum clock speed, referred to as the "base clock". This clock speed is set to the level which will ensure that the GPU stays within TDP specifications, even at maximum loads. [3]
The dynamic power (switching power) dissipated by a chip is C·V 2 ·A·f, where C is the capacitance being switched per clock cycle, V is voltage, A is the activity factor [1] indicating the average number of switching events per clock cycle by the transistors in the chip (as a unitless quantity) and f is the clock frequency.
Properly applied thermal interface materials displace the air that is present in the gaps between the two objects with a material that has a much-higher thermal conductivity. Air has a thermal conductivity of 0.022 W/(m·K) [19] while TIMs have conductivities of 0.3 W/(m·K) [20] and higher.
At Hot Chips 2016, Samsung announced GDDR6 as the successor of GDDR5X. [5] [6] Samsung later announced that the first products would be 16 Gbit/s, 1.35 V chips.[7] [8] In January 2018, Samsung began mass production of 16 Gb (2 GB) GDDR6 chips, fabricated on a 10 nm class process and with a data rate of up to 18 Gbit/s per pin.
Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades.