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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
Hermes is a machine-to-machine communication standard used in the SMT assembly industry. [1]IPC-HERMES-9852. It is a successor to the SMEMA standard, introducing improvements such as: simpler physical wiring (Ethernet), use of popular data transmission formats (TCP/IP and XML), reduced number of barcode scanners (required only once at the beginning of the line), transmission of board data ...
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.
1A1A44J5 - Unit 1, Assembly 1, Sub-Assembly 44, Jack 5 (J5 is a connector on a box referenced as A44) 1A1A45J333 - Unit 1, Assembly 1, Sub-Assembly 45, Jack 333 (J333 is a connector on a box referenced as A45) A cable connecting these two might be: 1A1W35 - In the assembly A1 is a cable called W35. Connectors on this cable would be designated:
The IPC preferred term for an assembled board is circuit card assembly (CCA), [20] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card. A PCB may be printed with a legend identifying the components, test points, or identifying
The IPC-NC-349 format is the only IPC standard governing drill and routing formats. [5] XNC is a strict subset of IPC-NC-349, Excellon a big superset. Many indefinite NC files pick some elements of the IPC standard. [1] A digital rights managed copy of the specification is available from the IPC website, for a fee.
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.
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