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The overall cooling efficiency depends on how the air distribution system moves air through the equipment room, how the equipment moves air through the equipment frames, and how these airflows interact with one another. High heat-dissipation levels rely heavily on a seamless integration of equipment-cooling and room-cooling designs.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
In combinatorial game theory, cooling, heating, and overheating are operations on hot games to make them more amenable to the traditional methods of the theory, which was originally devised for cold games in which the winner is the last player to have a legal move. [1] Overheating was generalised by Elwyn Berlekamp for the analysis of ...
The Seebeck coefficient (also known as thermopower, [1] thermoelectric power, and thermoelectric sensitivity) of a material is a measure of the magnitude of an induced thermoelectric voltage in response to a temperature difference across that material, as induced by the Seebeck effect. [2]
Every human activity, transport and industrial process generates waste heat, being possible to harvest residual energy from cars, aircraft, ships, industries and the human body. [1] From cars the main source of energy is the exhaust gas. [32] Harvesting that heat energy using a thermoelectric generator can increase the fuel efficiency of the car.
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The thermoelectric effect is the direct conversion of temperature differences to electric voltage and vice versa via a thermocouple. [1] A thermoelectric device creates a voltage when there is a different temperature on each side.
The two top thermocouple junctions are at temperature T 1 while the two bottom thermocouple junctions are at temperature T 2. The output voltage from the thermopile, ΔV , is directly proportional to the temperature differential, ΔT or T 1 - T 2 , across the thermal resistance layer and number of thermocouple junction pairs.