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MEMS microcantilever resonating inside a scanning electron microscope Proposal submitted to DARPA in 1986 first introducing the term "microelectromechanical systems". MEMS (micro-electromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts.
Depending upon the type of resonator, the fabrication process is either done in a specialized MEMS fab or a CMOS foundry. The manufacturing process varies with resonator and encapsulation design, but in general the resonator structures are lithographically patterned and plasma-etched in or on silicon wafers. All commercial MEMS oscillators are ...
Deep reactive-ion etching (DRIE) is a special subclass of reactive-ion etching (RIE). It enables highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios.
Bulk micromachining [1] is a process used to produce micromachinery or microelectromechanical systems (MEMS). Unlike surface micromachining, which uses a succession of thin film deposition and selective etching, bulk micromachining defines structures by selectively etching inside a substrate.
The prior art includes an RF MEMS frequency tunable fractal antenna for the 0.1–6 GHz frequency range, [18] and the actual integration of RF MEMS switches on a self-similar Sierpinski gasket antenna to increase its number of resonant frequencies, extending its range to 8 GHz, 14 GHz and 25 GHz, [19] [20] an RF MEMS radiation pattern ...
The first reported piezoelectrically actuated RF MEMS switch was developed by scientists at the LG Electronics Institute of Technology in Seoul, South Korea in 2005. [3] The researchers designed and actualized a RF MEMS switch with a piezoelectric cantilever actuator that had an operation voltage of 2.5 volts. [7]
Microforming is a microfabrication process of microsystem or microelectromechanical system (MEMS) "parts or structures with at least two dimensions in the submillimeter range." [3] [4] [5] It includes techniques such as microextrusion, [4] microstamping, [6] and microcutting. [7]
In the 1990s, LIGA was a cutting-edge MEMS fabrication technology, resulting in the design of components showcasing the technique's unique versatility. Several companies that begin using the LIGA process later changed their business model (e.g., Steag microParts becoming Boehringer Ingelheim microParts, Mezzo Technologies).