enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

3. Desoldering - Wikipedia

   en.wikipedia.org/wiki/Desoldering

   A typical spring-loaded solder sucker A solder sucker partially dismantled showing the spring. A desoldering pump, colloquially known as a solder sucker, is a manually-operated device which is used to remove solder from a printed circuit board. There are two types: the plunger style and bulb style. [1]

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Wave soldering uses surface tension to keep solder from bridging the insulating gaps between the copper lines of flux-coated printed wiring boards/printed circuit boards. The electric soldering iron is widely used for hand-soldering, consisting of a heating element in contact with the "iron" (a larger mass of metal, usually copper) which is in ...

5. Head-in-pillow defect - Wikipedia

   en.wikipedia.org/wiki/Head-in-pillow_defect

   For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit ...

6. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used. High T g potting compounds may break solder bonds through solder fatigue by hardening at a higher temperature because the coating then shrinks as a rigid solid over a larger part ...

7. Hot air solder leveling - Wikipedia

   en.wikipedia.org/wiki/Hot_air_solder_leveling

   HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives.

8. Dip soldering - Wikipedia

   en.wikipedia.org/wiki/Dip_soldering

   Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask ), creating a reliable mechanical and electrical connection.

9. Component placement - Wikipedia

   en.wikipedia.org/wiki/Component_placement

   Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...