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  2. Chemical-mechanical polishing - Wikipedia

    en.wikipedia.org/wiki/Chemical-mechanical_polishing

    Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. [ 1 ]

  3. Surface finishing - Wikipedia

    en.wikipedia.org/wiki/Surface_finishing

    Polishing lines will be soft and less reflective than a #4 architectural finish. #7 Finish. A #7 finish is produced by polishing with a 280–320 grit belt or wheel and sisal buffing with a cut and color compound. This is a semi-bright finish that will still have some polishing lines but they will be very dull.

  4. Cerium(IV) oxide - Wikipedia

    en.wikipedia.org/wiki/Cerium(IV)_oxide

    The principal industrial application of ceria is for polishing, especially chemical-mechanical planarization (CMP). [3] For this purpose, it has displaced many other oxides that were previously used, such as iron oxide and zirconia. For hobbyists, it is also known as "opticians' rouge". [20] [21]

  5. SEMATECH and Cabot Microelectronics Collaborate to Accelerate ...

    www.aol.com/news/2013-02-14-sematech-and-cabot...

    SEMATECH and Cabot Microelectronics Collaborate to Accelerate Chemical Mechanical Planarization Technology for Future Devices ALBANY, N.Y.--(BUSINESS WIRE)-- SEMATECH today announced that Cabot ...

  6. Polishing - Wikipedia

    en.wikipedia.org/wiki/Polishing

    Chemical-mechanical polishing, which is used in semiconductor fabrication; Fabrication and testing of optical components; Flame polishing, a type of polishing used on glass and thermoplastics; Ultra-fine, abrasive paste polishing, polishing for soft or fragile work surfaces; Vapor polishing, a method of polishing plastics to optical clarity

  7. Cerium - Wikipedia

    en.wikipedia.org/wiki/Cerium

    The industrial application of ceria is for polishing, especially chemical-mechanical planarization (CMP). In its other main application, CeO 2 is used to decolorize glass. It functions by converting green-tinted ferrous impurities to nearly colorless ferric oxides. [55]

  8. CMP - Wikipedia

    en.wikipedia.org/wiki/CMP

    Chemical-mechanical polishing, a technique used in semiconductor fabrication; also known as planarization; Command Module Pilot, a position of the Apollo program crewed missions; Condensed matter physics, a branch of physics; Conjugated microporous polymer, a type of porous material; Cytidine monophosphate

  9. Versum Materials - Wikipedia

    en.wikipedia.org/wiki/Versum_Materials

    Versum Materials, Inc. is an American company that manufactures chemical-mechanical planarization slurries, ultra-thin dielectric and metal precursors of film, formulated cleans and etching products, and delivery equipment for the semiconductor industry. It is a subsidiary of Merck Group.