enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

3. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   The equipment and materials used in this stage are a stencil, solder paste, and a printer. The stencil printing function is achieved through a single material namely solder paste which consists of solder metal and flux. Paste also acts as an adhesive during component placement and solder reflow. The tackiness of the paste enables the components ...

4. Graping - Wikipedia

   en.wikipedia.org/wiki/Graping

   The increased surface oxidation is the result of smaller printed paste deposit volumes that cause a diminished surface area to flux ratio of the solder particle, resulting in flux exhaustion. While solder paste can be manufactured using any size range, there has been a move towards finer particle sizes, especially for fine feature stencil ...

5. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process ...

6. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

7. Turn Off the Oven for the Easiest No-Bake Eggnog Pie - AOL

   www.aol.com/turn-off-oven-easiest-no-211700321.html

   Yields: 6-8 servings. Prep Time: 20 mins. Total Time: 12 hours 20 mins. Ingredients. 1 c. cold eggnog. 1/2 tsp. ground nutmeg, plus more for garnish. 1 (3.4-oz.) box instant vanilla pudding mix

8. Why do teens say, ‘Fax, No Printer’? - AOL

   www.aol.com/news/why-teens-fax-no-printer...

   Wright says inspiration for the slang is older than a fax machine itself. “The use of ‘fax’ as a fun phonetic play on ‘facts’ dates back to at least 1837, as documented by the Oxford ...

9. Pick-and-place machine - Wikipedia

   en.wikipedia.org/wiki/Pick-and-place_machine

   The components may be temporarily adhered to the PCB using the wet solder paste itself, or by using small blobs of a separate adhesive, applied by a glue-dispensing machine that can be incorporated on to the pick and place machine. The glue is added before component placement.