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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

3. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inserting the component leads through the paste. Wave soldering however, has been the common method of soldering multi-leaded through-hole components onto a circuit board designed ...

4. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

5. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   Chennai, India: Surface Mount Technology Association (SMTA). Archived (PDF) from the original on 2018-06-17; Mersits, Christopher (2012) [2010]. Investigation of aperture filling and release for modern developments of the solder paste stencil printing process. Binghamton, New York, USA: State University of New York. pp. 4–5, 9–10. 1535200.

6. Flat no-leads package - Wikipedia

   en.wikipedia.org/wiki/Flat_no-leads_package

   Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.

7. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Dispensed solder paste on the pads of a QFPs Mask and spheres for reballing. Heating a single SMD with a hot-air gun to melt all solder joints between it and the PCB is usually the first step, followed by removing the SMD while the solder is molten. The pad array on the conductor board should then be cleaned of old solder.