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2. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   SMD (non-electrolytic) capacitors, which are usually monolithic ceramic capacitors, exhibit the same body color on all four faces not covered by the end caps. SMD electrolytic capacitors, usually tantalum capacitors, and film capacitors are marked like resistors, with two significant figures and a multiplier in units of picofarads or pF, (10 ...

3. Ceramic capacitor - Wikipedia

   en.wikipedia.org/wiki/Ceramic_capacitor

   Ceramic capacitors may experience changes to their electrical parameters due to soldering stress. The heat of the solder bath, especially for SMD styles, can cause changes of contact resistance between terminals and electrodes. For ferroelectric class 2 ceramic capacitors, the soldering temperature is above the Curie point. The polarized ...

4. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

5. Through-hole technology - Wikipedia

   en.wikipedia.org/wiki/Through-hole_technology

   Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.

6. Metal electrode leadless face - Wikipedia

   en.wikipedia.org/wiki/Metal_electrode_leadless_face

   During automated SMT pick-and-place, this happens mostly if the mechanical pressure of the SMD placer nozzle is too low. If the MELF components are placed into the solder paste with enough pressure, then this problem can be minimized. Care must be taken with glass diodes which are less mechanically robust than resistors and other MELF components.

7. Dip soldering - Wikipedia

   en.wikipedia.org/wiki/Dip_soldering

   Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask ), creating a reliable mechanical and electrical connection.

8. Capacitor types - Wikipedia

   en.wikipedia.org/wiki/Capacitor_types

   The greatest stress factor is soldering. The heat of the solder bath, especially for SMD capacitors, can cause ceramic capacitors to change contact resistance between terminals and electrodes; in film capacitors, the film may shrink, and in wet electrolytic capacitors the electrolyte may boil.

9. Polymer capacitor - Wikipedia

   en.wikipedia.org/wiki/Polymer_capacitor

   The predominant application of all electrolytic capacitors is in power supplies.They are used in input and output smoothing capacitors, as decoupling capacitors to circulate the harmonic current in a short loop, as bypass capacitors to shunt AC noise to the ground by bypassing the power supply lines, as backup capacitors to mitigate the drop in line voltage during sudden power demand or as ...