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In electronics and electrical engineering, the form factor of an alternating current waveform (signal) is the ratio of the RMS (root mean square) value to the average value (mathematical mean of absolute values of all points on the waveform). [1] It identifies the ratio of the direct current of equal power relative to the given alternating ...
Form factor is a hardware design aspect that defines and prescribes the size, shape, and other physical specifications of components, particularly in electronics. [ 1 ] [ 2 ] A form factor may represent a broad class of similarly sized components, or it may prescribe a specific standard.
VPX retained VME's Eurocard form factors, which are based on multiples of three rack units: 3U means three rack units, and 6U six rack units. It supported PCI Mezzanine Card (PMC) and XMC mezzanines (PMC with high-speed serial fabric interconnect), and maintaining the maximum possible compatibility with VMEbus.
Mechanical rectifiers used some form of rotation or resonant vibration driven by electromagnets, which operated a switch or commutator to reverse the current. These mechanical rectifiers were noisy and had high maintenance requirements, including lubrication and replacement of moving parts due to wear.
Differences between form factors are most apparent in terms of their intended market sector, and involve variations in size, design compromises and typical features. Most modern computers have very similar requirements, so form factor differences tend to be based upon subsets and supersets of these.
The Small Form Factor with a 12 V connector (SFX12V) configuration has been optimized for small form factor (SFF) system layouts such as microATX. The low profile of the power supply fits easily into these systems.
Form factor (design), an aspect of design which defines and prescribes the size, shape, and other physical specifications of hardware components, particularly in electronics and electronic packaging Form factor (mobile phones) Motherboard form factor; Hard disk drive form factor
Although direct and indirect liquid cooling may be introduced in the future, the current design of new electronic equipment is geared towards maintaining air as the cooling medium. [13] A well-developed "holistic" approach is required to understand current and future thermal management problems.