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Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films .
The so-called remote combustion chemical vapour deposition is a new variant of the classical CCVD process. It likewise uses flames to deposit thin films, however, this method is based on other chemical reaction mechanisms and offers further abilities for deposition of layer systems which are not practicable by means of CCVD, e.g. titanium dioxide.
In the metal organic chemical vapor deposition (MOCVD) technique, reactant gases are combined at elevated temperatures in the reactor to cause a chemical interaction, resulting in the deposition of materials on the substrate. A reactor is a chamber made of a material that does not react with the chemicals being used.
Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases.
The laser ablation method yields around 70% and produces primarily single-walled carbon nanotubes with a controllable diameter determined by the reaction temperature. However, it is more expensive than either arc discharge or chemical vapor deposition. [4]
In chemistry, a precursor is a compound that contributes in a chemical reaction and produces another compound, or a chemical substance that gives rise to another more significant chemical product. Since several years metal-organic compounds are widely used as molecular precursors for the chemical vapor deposition process (MOCVD).
When the vapor source is a liquid or solid, the process is called physical vapor deposition (PVD), [3] which is used in semiconductor devices, thin-film solar panels, and glass coatings. [4] When the source is a chemical vapor precursor, the process is called chemical vapor deposition (CVD).
Chemical vapor deposition (CVD) is a bottom-up chemical deposition method used to construct high-quality nanoscale films. In CVD, a substrate is exposed to precursors, which react on the wafer surface to produce the desired film. This reaction often also results in toxic byproducts.