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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...
There are several types of gold plating used in the electronics industry: [3] Soft, pure gold plating is used in the semiconductor industry. The gold layer is easily soldered and wire bonded. Its Knoop hardness ranges between 60 and 85. The plating baths have to be kept free of contamination. Soft, pure gold is deposited from special electrolytes.
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.
The IPC-NC-349 format is the only IPC standard governing drill and routing formats. [5] XNC is a strict subset of IPC-NC-349, Excellon a big superset. Many indefinite NC files pick some elements of the IPC standard. [1] A digital rights managed copy of the specification is available from the IPC website, for a fee.
IPC standards revised the definition of a microvia in 2013 to a hole with depth to diameter aspect ratio of 1:1 or less, and the hole depth not to exceed 0.25mm. Previously, microvia was any hole less than or equal to 0.15mm in diameter [ 2 ]
The possible increase in the use of pure tin in electronics due to the RoHS directive drove JEDEC and IPC to release a tin whisker acceptance testing standard and mitigation practices guideline intended to help manufacturers reduce the risk of tin whiskers in lead-free products. [13]
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