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One very common positive photoresist used with the I, G and H-lines from a mercury-vapor lamp is based on a mixture of diazonaphthoquinone (DNQ) and novolac resin (a phenol formaldehyde resin). DNQ inhibits the dissolution of the novolac resin, but upon exposure to light, the dissolution rate increases even beyond that of pure novolac.
The term comes from Swedish "lack" for lacquer and Latin "novo" for new, since these materials were envisioned to replace natural lacquers such as copal resin. Typically novolaks are prepared by the condensation of phenol or a mixture of p- and m-cresol with formaldehyde (as formalin). The reaction is acid catalyzed.
In this way, DNQ has become an important reagent in photoresist technology in the semiconductor industry. [1] Diazonaphthoquinone sulfonic acid esters are components of common photoresist materials. Such photoresists are used in the manufacture of semiconductors. [2] [3] [4] In this application DNQs are mixed with Novolac resin, a type of ...
Positive photoresists are composed of a novolac resin, ethyl lactate solvent, and Diazonaphthaquinone (DQ) as the photoactive compound. [9] Positive photoresist reacts with light to cause the polymer to break down and become soluble in a developer solution. Positive resist has better resistance to etchant than negative photoresist.
Phenol-formaldehyde resins, as a group, are formed by a step-growth polymerization reaction that can be either acid- or base-catalysed.Since formaldehyde exists predominantly in solution as a dynamic equilibrium of methylene glycol oligomers, the concentration of the reactive form of formaldehyde depends on temperature and pH.
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. As shown in the structural diagram, SU-8 derives its name from the presence of 8 epoxy groups.
AVCOAT was first used on the parts of the Apollo spacecraft orbiter and as a unit attached to the crew module. The heat shield is a honeycomb structure filled with the AVCOAT. NASA confirmed that this is made of silica fibers with an epoxy novolac resin filled in a fiberglass-phenolic manufactured directly onto the heat shield.
Left: individual linear polymer chains Right: Polymer chains which have been cross linked to give a rigid 3D thermoset polymer. In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer (). [1]