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  2. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    A heat sink usually consists of a base with one or more flat surfaces and an array of comb or fin-like protrusions to increase the heat sink's surface area contacting the air, and thus increasing the heat dissipation rate. While a heat sink is a static object, a fan often aids a heat sink by providing increased airflow over the heat sink—thus ...

  3. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...

  4. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    A heat sink (aluminum) with its heat pipes (copper) and fan (black) A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of ...

  5. Thermoelectric cooling - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_cooling

    Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.

  6. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  7. Thermoelectric effect - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_effect

    The Peltier effect can be considered as the back-action counterpart to the Seebeck effect (analogous to the back-EMF in magnetic induction): if a simple thermoelectric circuit is closed, then the Seebeck effect will drive a current, which in turn (by the Peltier effect) will always transfer heat from the hot to the cold junction.

  8. Thermoelectric generator - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_generator

    These are solid-state devices and unlike dynamos have no moving parts, with the occasional exception of a fan or pump to improve heat transfer. If the hot region is around 1273K and the ZT values of 3 - 4 are implemented, the efficiency is approximately 33-37%; allowing TEG's to compete with certain heat engine efficiencies.

  9. Cascade refrigeration - Wikipedia

    en.wikipedia.org/wiki/Cascade_refrigeration

    A two stage Peltier cooler can achieve around -30°C, -75°C with three stages, -85°C with four stages, -100°C with six stages, and -123°C with seven stages. Refrigeration power and efficiency are low but Peltier coolers can be small, for small cooling loads resulting in overall low power consumption for a Peltier cooler with three stages.

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