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TRX50 is an HEDT (High-End Desk-Top) platform which is intended to be paired with Threadripper (7000X) series processors, but is also compatible with Threadripper Pro models. When a Threadripper Pro CPU is paired with a TRX50 motherboard, extra features like enterprise management and security won't be available to the user, and PCIe lanes and ...
Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] launched for mobile in July 2024 and for desktop in August 2024. [4] It is the successor to Zen 4 and is currently fabricated on TSMC 's N4X process. [ 5 ]
Some Xeon Phi processors support four-way hyper-threading, effectively quadrupling the number of threads. [1] Before the Coffee Lake architecture, most Xeon and all desktop and mobile Core i3 and i7 supported hyper-threading while only dual-core mobile i5's supported it.
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
An iterative refresh of Raptor Lake-S desktop processors, called the 14th generation of Intel Core, was launched on October 17, 2023. [1] [2]CPUs in bold below feature ECC memory support only when paired with a motherboard based on the W680 chipset according to each respective Intel Ark product page.
AMD FX are a series of high-end AMD microprocessors for personal computers which debuted in 2011, claimed as AMD's first native 8-core desktop processor. [1] The line was introduced with the Bulldozer microarchitecture at launch (codenamed "Zambezi"), and was then succeeded by its derivative Piledriver in 2012 (codenamed "Vishera").
Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA) CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x; Package size: 37.5 mm × 37.5 mm; Steppings: B0; TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
It has 1331 pin slots and is the first from AMD to support DDR4 memory as well as achieve unified compatibility between high-end CPUs (previously using Socket AM3+) and AMD's lower-end APUs (on various other sockets). [3] [4] In 2017, AMD made a commitment to using the AM4 platform with socket 1331 until 2020.
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