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It supplies heat to melt solder so that it can flow into the joint between two workpieces. A soldering iron is composed of a heated metal tip (the bit ) and an insulated handle. Heating is often achieved electrically, by passing an electric current (supplied through an electrical cord or battery cables) through a resistive heating element .
A hot air gun or hot air station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components. A rework station is a place to do this work—the tools and supplies for this work, typically on a workbench .
In this soldering process, heat is applied to the parts to be joined, causing the solder to melt and to bond to the workpieces in a surface alloying process called wetting. In stranded wire, the solder is drawn up into the wire between the strands by capillary action in a process called 'wicking'. Capillary action also takes place when the ...
The tip of this apparatus is split into two sections that completes an electrical circuit when a low electrical resistance is placed across the tip; e.g. metallic contacts, or solder. [1] With a current flowing, the resistance of both the solder and the tip produces enough heat to increase the temperature beyond the melting point of solder.
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The stubs are then easy to melt off and clean with a soldering iron. Obviously this technique entails the destruction of the IC. Another method is to use a heat gun or pencil butane torch and heat up a corner, and gently pry it off, working the torch down the leads. This method often leads to traces getting lifted off the PCB where a lead did ...
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
The most common are the models with 50-80 W power. The higher is the power the more amount of heat you may transmit for the same time. It allows reducing the temperature on the heating element to the minimal possible value for melting the solder alloy. And vice versa – the lower is the power the higher temperature you need to melt the solder.