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LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020. [1] [2] LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4).
Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
Socket G2: 2011 Intel Core i7 Intel Core i5 Intel Core i3 (2000, 3000 series) Notebook rPGA: 988 1 2.5 GT/s, 4.8 GT/s Socket FM1: 2011 AMD Llano Processors: Desktop PGA: 905 1.27 5.2 GT/s used for 1st generation APUs Socket FS1: 2011 AMD Llano Processors: Notebook PGA: 722 1.27 3.2 GT/s used for 1st generation Mobile APUs Socket AM3+ 2011
An iterative refresh of Raptor Lake-S desktop processors, called the 14th generation of Intel Core, was launched on October 17, 2023. [1] [2]CPUs in bold below feature ECC memory support when paired with a motherboard based on the W680 chipset according to each respective Intel Ark product page.
Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA) CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x; Package size: 37.5 mm × 37.5 mm; Steppings: B0; TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
Intel announced low-power mobile Comet Lake-U CPUs on August 21, 2019, [5] H-series mobile CPUs on April 2, 2020, [6] desktop Comet Lake-S CPUs April 30, 2020, [7] and Xeon W-1200 series workstation CPUs on May 13, 2020. [8] Comet Lake processors and Ice Lake 10 nm processors are together branded as the Intel "10th Generation Core" family. [9]
In each generation, the highest-performing Core i7 processors use the same socket and QPI-based architecture as the medium-end Xeon processors of that generation, while lower-performing Core i7 processors use the same socket and PCIe/DMI/FDI architecture as the Core i5. "Core i7" is a successor to the Intel Core 2 brand.
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