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TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads; TO-226 [23] TO-247: [24] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink; TO-251: [24] Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
High performance GPU-accelerated ab initio molecular dynamics and TD/DFT software package for very large molecular or even nanoscale systems. Runs on NVIDIA GPUs and 64-bit Linux, has heavily optimized CUDA code. Proprietary, trial licenses available PetaChem LLC: TINKER: I Yes Yes Yes Yes I I Yes Yes Software tools for molecular design-Tinker ...
This is a list of application software written using the Electron software framework to provide the graphical user interface. List. 1Password; Atom [1] (discontinued)
Electron applications include a "main" process and several "renderer" processes. The main process runs the logic for the application (e.g., menus, shell commands, lifecycle events), and can then launch multiple renderer processes by instantiating an instance of the BrowserWindow class, which loads a window that appears on the screen by ...
C++Builder: Proprietary, Freeware (Starter edition only) Yes No (Cross compiler planned) Yes (Cross compiler) cross-compiles for Android and iOS: C++ and Object Pascal: Yes Yes Yes Yes (AQTime Standard in package manager) Yes Yes Yes Yes Yes 2017-03 Tokyo 10.2 Yes Yes Yes Code::Blocks: GPL: Yes Yes Yes FreeBSD, OpenBSD, Solaris: C++: Yes Yes ...
The electron–hole pair is the fundamental unit of generation and recombination in inorganic semiconductors, corresponding to an electron transitioning between the valence band and the conduction band where generation of an electron is a transition from the valence band to the conduction band and recombination leads to a reverse transition.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged.
Package on a package (PoP) is an integrated circuit packaging method to vertically combine ball grid array (BGA) packages for discrete logic and memory. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.