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Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...
In response, Erie Plating Company issued the following statement: In view of the adverse court decision metal finishers throughout the state are now liable for Use Tax dating back to September 1, 1953 plus a 25% penalty plus interest at 6%. What this means to the metal finishing industry in Pennsylvania is tragic to contemplate.
Mechanical plating, also known as peen plating, mechanical deposition, or impact plating, is a plating process that imparts the coating by cold welding fine metal particles to a workpiece. Mechanical galvanization is the same process, but applies to coatings that are thicker than 0.001 in (0.025 mm). [ 1 ]
Before plating, the surface of the material must be thoroughly cleaned. Unwanted solids left on the surface cause poor plating. Cleaning is usually achieved by a series of chemical baths, including non-polar solvents to remove oils and greases, as well as acids and alkalis to remove oxides, insoluble organics, and other surface contaminants.
Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer on copper, typically in electrical connectors and printed circuit boards. With direct gold-on-copper plating, the copper atoms tend to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide and/or ...
Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
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