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Metallic bonding, which forms metallic solids; Weak inter molecular bonding, which forms molecular solids (sometimes anomalously called "covalent solids") Typical members of these classes have distinctive electron distributions, [2] thermodynamic, electronic, and mechanical properties. In particular, the binding energies of these interactions ...
Metallic bonding is mostly non-polar, because even in alloys there is little difference among the electronegativities of the atoms participating in the bonding interaction (and, in pure elemental metals, none at all). Thus, metallic bonding is an extremely delocalized communal form of covalent bonding.
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A less often mentioned type of bonding is metallic bonding. In this type of bonding, each atom in a metal donates one or more electrons to a "sea" of electrons that reside between many metal atoms. In this sea, each electron is free (by virtue of its wave nature) to be associated with a great many atoms at once. The bond results because the ...
In chemistry, a metallophilic interaction is defined as a type of non-covalent attraction between heavy metal atoms. The atoms are often within Van der Waals distance of each other and are about as strong as hydrogen bonds. [1]
In microelectronics, these properties can cause problems in wire bonding. The main compounds formed are usually Au 5 Al 2 (white plague) and AuAl 2 (purple plague), both of which form at high temperatures, then Au 5 Al 2 and AuAl 2 can further react with Au to form more stable compound, Au 2 Al.
The halides of low-valent early metals often are clusters with extensive M-M bonding. The situation contrasts with the higher halides of these metals and virtually all halides of the late transition metals, where metal-halide bonding is replete. Transition metal halide clusters are prevalent for the heavier metals: Zr, Hf, Nb, Ta, Mo, W, and Re.