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Tungsten carbide (chemical formula: WC) is a chemical compound (specifically, a carbide) containing equal parts of tungsten and carbon atoms. In its most basic form, tungsten carbide is a fine gray powder, but it can be pressed and formed into shapes through sintering [7] for use in industrial machinery, engineering facilities, [8] molding blocks, [9] cutting tools, chisels, abrasives, armor ...
The first cemented carbide developed was tungsten carbide (introduced in 1927) which uses tungsten carbide particles held together by a cobalt metal binder. Since then, other cemented carbides have been developed, such as titanium carbide, which is better suited for cutting steel, and tantalum carbide, which is tougher than tungsten carbide. [1]
In 1926, Krupp, a German company, developed carbide, a very hard mixture of sintered carbides of various heavy metals, especially tungsten carbide, used for cutting edges and dies. This new material revolutionized metal-removal or “chip-cutting” in manufacturing. In the 1950s, carbide was used in all machining processes except for sawing.
Some of them, including titanium carbide and tungsten carbide, are important industrially and are used to coat metals in cutting tools. [3] The long-held view is that the carbon atoms fit into octahedral interstices in a close-packed metal lattice when the metal atom radius is greater than approximately 135 pm: [2]
Tungsten compounds are often used as industrial catalysts. Its largest use is in tungsten carbide, a wear-resistant metal used in metalworking, mining, and construction. [22] About 50% of tungsten is used in tungsten carbide, with the remaining major use being alloys and steels: less than 10% is used other compounds. [23]
Korea Tungsten Company (KTC, Korean: 대한중석; Hanja: 大韓重石; RR: daehan jungseok was a major South Korean manufacturer of tungsten cutting tools, tungsten powder, and related metal-cutting products. It was the 28th-largest chaebol by asset [1] with subsidiaries such as Korea Tungsten Construction and Korea Sintered Metal. In 1952 ...
In the semiconductor industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. The round shape characteristic of these wafers comes from single-crystal ingots usually produced using the Czochralski method. Silicon wafers were first introduced in the 1940s. [2] [3]
Palm's Tungsten E was the cheapest of the Tungsten series, and as such, has been one of the most successful. [citation needed] It has 32 megabytes of memory, a Texas Instruments OMAP (ARM) 126 MHz processor, a 2 + 1 ⁄ 8-by-2 + 1 ⁄ 8-inch (54 mm × 54 mm) transreflective TFT screen, and ran Palm OS 5.2.1.
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