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This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit (iGPU), including those under the AMD APU (Accelerated Processing Unit) product series. Features overview
Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) [1] CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. [ 2 ] [ 3 ] AM5 was launched in September 2022 and is the successor to AM4 .
AMD announced the Brazos-T platform on 9 October 2012. It comprised the 4.5-watt AMD Z-Series APU (codenamed Hondo) and the A55T Fusion Controller Hub (FCH), designed for the tablet computer market. [42] [43] The Hondo APU is a redesign of the Desna APU. AMD lowered energy use by optimizing the APU and FCH for tablet computers. [44] [45]
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and ...
AMD K5: SSA/5, 5k86 1 No 75–133 50, 60, 66 FSB 8+16 0 Socket 5 Socket 7: discrete: K6 350, 250 AMD K6: Model 6, Littlefoot 1 No 166–300 50, 60, 66 FSB 32+32 0 Socket 7: discrete: MMX + MMX: 250, 180 AMD K6-2: Chomper, Chomper Extended, mobile 166–550 66, 95, 97, 100 FSB 32+32 0, 128 Super Socket 7: MMX, 3DNow! + 3DNow! 250, 180 K6-3 ...
The AMD Opteron A1100 is an enterprise-class ARM Cortex-A57-based SOC. Up to 64 GB DDR3L-1600 and up to 128GB DDR4-1866 with ECC SoC peripherals include 6 × SATA 3, 2 × Integrated 10 GbE LAN and 8 PCI Express lanes in ×8, ×4 and ×2 configurations.
Llano AMD Fusion (K10 cores + Redwood-class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017) [ edit ]
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.