Search results
Results from the WOW.Com Content Network
The 65 nm process is an advanced lithographic node used in volume CMOS semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm.
The technology used a 32 nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design. Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in ...
reengineered P6-based microarchitecture used in Intel Core 2 and Xeon microprocessors, built on a 65 nm process, supporting x86-64 level SSE instruction and macro-op fusion and enhanced micro-op fusion with a wider front end and decoder, larger out-of-order core and renamed register, support loop stream detector and large shadow register file.
Process variation is the naturally occurring variation in the attributes of transistors (length, widths, oxide thickness) when integrated circuits are fabricated.The amount of process variation becomes particularly pronounced at smaller process nodes (<65 nm) as the variation becomes a larger percentage of the full length or width of the device and as feature sizes approach the fundamental ...
The new six-input LUT represented a tradeoff between better handling of increasingly complex combinational functions, at the expense of a reduction in the absolute number of LUTs per device. The Virtex-5 series is a 65 nm design fabricated in 1.0 V, triple-oxide process technology. [22] [23]
In CPU fabrications, a die shrink always involves an advance to a lithographic node as defined by ITRS (see list). For GPU and SoC manufacturing, the die shrink often involves shrinking the die on a node not defined by the ITRS, for instance, the 150 nm, 110 nm, 80 nm, 55 nm, 40 nm and more currently 8 nm nodes, sometimes referred to as "half-nodes".
65 nm 503 8 / 1 2007 TILE64: Tilera: 600–900 MHz 90–45 nm ? 64 / 1 2007 Opteron "Barcelona" AMD: 1.8–3.2 GHz 65 nm 463 4 / 1 2007 PowerPC BGP: IBM: 850 MHz 90 nm 208 4 / 1 2008 Phenom: AMD: 1.8–2.6 GHz 65 nm 450 2, 3, 4 / 1 2008 z10: IBM: 4.4 GHz 65 nm 993 4 / 7 2008 PowerXCell 8i: IBM: 2.8–4.0 GHz 65 nm 250 1+8 / 1 2008 SPARC64 VII ...
The reduction to 65 nm reduced the existing 230 mm 2 die based on the 90 nm process to half its current size, about 120 mm 2, greatly reducing IBM's manufacturing cost as well. On 12 March 2007, IBM announced that it started producing 65 nm Cells in its East Fishkill fab. The chips produced there are apparently only for IBMs own Cell blade ...