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The BorgWarner developed turbo can produce up to 27 psi (1.9 bar) of boost thanks in part to its unique dual volute turbine housing and an electrically actuated wastegate. Instead of two side-by-side exhaust passages like on a regular twin-scroll turbocharger , in this design the two exhaust passages are concentric and allow for better use of ...
The thermal conductivity of heat pipes can be as high as 100,000 W/m K, in contrast to copper, which has a thermal conductivity of around 400 W/m K. [8] Peltier cooling plates Main article: Thermoelectric effect § Peltier effect
Active cooling is a heat-reducing mechanism that is typically implemented in electronic devices and indoor buildings to ensure proper heat transfer and circulation from within. Unlike its counterpart passive cooling, active cooling is entirely dependent on energy consumption in order to operate. It uses various mechanical systems that consume ...
The EATCS is capable of rejecting up to 70 kW, and provides a substantial upgrade in heat rejection capacity from the 14 kW capability of the Early External Active Thermal Control System (EEATCS) via the Early Ammonia Servicer (EAS), which was launched on STS-105 and installed onto the P6 Truss. [1]
The thermal control subsystem can be composed of both passive and active items and works in two ways: Protects the equipment from overheating, either by thermal insulation from external heat fluxes (such as the Sun or the planetary infrared and albedo flux), or by proper heat removal from internal sources (such as the heat emitted by the internal electronic equipment).
Using the equations 5 to 13 and the dimensional data in, [24] the thermal resistance for the fins was calculated for various air flow rates. The data for the thermal resistance and heat transfer coefficient are shown in the diagram, which shows that for an increasing air flow rate, the thermal resistance of the heat sink decreases.
For instance, a safety margin taking into account some turbo overclocking could consider a thermal power that is 1.5 times the rated TDP. In any case, the lower is the silicon junction temperature, the longer will be the lifespan of the device, according to an acceleration factor very roughly expressed by means of the Arrhenius equation. [31 ...
Adhesive is a thermal conductive interface layer, [5] which is commonly used to bond LED and board, and board and heat sinks and further optimizes the thermal performance. Current commercial adhesive is limited by relatively low thermal conductivity ~1 W/(mK).