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2. Glass-to-metal seal - Wikipedia

   en.wikipedia.org/wiki/Glass-to-metal_seal

   Uranium glass used as lead-in seals in a vacuum capacitor. Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of ...

3. J-B Weld - Wikipedia

   en.wikipedia.org/wiki/J-B_Weld

   J-B Weld is a two-part epoxy adhesive (or filler) that can withstand high-temperature environments. J-B Weld can be used to bond surfaces made from metal, porcelain, ceramic, glass, marble, PVC, ABS, concrete, fiberglass, wood, fabric, or paper. [7] [8] Alcohol should be avoided when cleaning surfaces, as it can degrade the bond. [9]

4. Adhesive bonding - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding

   The adhesive used must, among other things, have enough strength, be dishwasher safe, and have sufficient elasticity to compensate for the different thermal expansion behaviour of glass and the plastic material of the handle to prevent glass breakage, and it has to maintain this performance over the entire life of the coffee machine, even at ...

5. Glass-ceramic-to-metal seals - Wikipedia

   en.wikipedia.org/wiki/Glass-ceramic-to-metal_seals

   The white opaque "glue" between the panel and the funnel of a colour TV cathode ray tube is a devitrified solder glass based on the system PbO – ZnO – B 2 O 3.While this is a glass-ceramic-to-glass seal, the basic patent of S.A. Claypoole considers glass-ceramic-to-metal seals as well.

6. Anodic bonding - Wikipedia

   en.wikipedia.org/wiki/Anodic_bonding

   Anodic bonding is commonly used to seal glass to silicon wafers in electronics and microfluidics. Anodic bonding, also known as field assisted bonding or electrostatic sealing, [1] is mostly used for connecting silicon/glass and metal/glass through electric fields. The requirements for anodic bonding are clean and even wafer surfaces and atomic ...

7. Adhesive bonding of semiconductor wafers - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding_of...

   There are three major requirements of creating a desirable surface for adhesive bonding of plastics: the weak boundary layer of the given material must be removed or chemically modified to create a strong boundary layer; the surface energy of the adherend should be higher than the surface energy of the adhesive for good wetting; and the surface profile can be improved to provide mechanical ...