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7068-T6511 has typical ultimate tensile strength of 710 MPa (103 ksi) versus a similar product produced from 7075-T6511 that would have a typical ultimate tensile strength of 640 MPa (93 ksi). Typical yield strength for alloy 7068-T6511 is 683 MPa (99.1 ksi) versus 590 MPa (86 ksi) for a similar product produced from 7075-T6511. [2]
For deep draw and complex shapes, and for the avoidance of spring-back, an aluminium hot stamping process (Hot Form Quench) can be used, which forms a blank at a elevated temperature (~ 550 C) in a cooled die, leaving a part in W-temper condition before artificial aging to the T6 full strength state.
Hot Form Quench (HFQ) is an aluminum hot stamping process for high strength sheet (typically) 2xxx, 6xxx and 7xxx series alloys, [6] that was initially developed in the early 2000s by Professors Jianguo Lin and Trevor Dean at the University of Birmingham and then at Imperial College London, both in the UK.
T5 temper 6063 has an ultimate tensile strength of at least 140 MPa (20,000 psi) in thicknesses up to 13 millimetres (0.5 in), and 130 MPa (19,000 psi) from 13 mm (0.5 in) thick, and yield strength of at least 97 MPa (14,000 psi) up to 13 millimetres (0.5 in) and 90 MPa (13,000 psi) from13 to 25 mm (0.5 to 1 in).
6082 aluminium alloy is an alloy in the wrought aluminium-magnesium-silicon family (6000 or 6xxx series). It is one of the more popular alloys in its series (alongside alloys 6005, 6061, and 6063), although it is not strongly featured in ASTM (North American) standards.
The aluminium-copper alloys have high strength, but are generally less corrosion resistant and harder to weld than other types of aluminium alloys. To compensate for the lower corrosion resistance, 2219 aluminium can be clad in a commercially pure alloy such as 1050 or painted.
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At 500 °C it is still 0.8% Si, at 400 °C 0.3% Si and at 250 °C only 0.05% Si. At room temperature, silicon is practically insoluble. Aluminum cannot be dissolved in silicon at all, not even at high temperatures. Only in the molten state are both completely soluble. Increases in strength due to solid solution strengthening are negligible. [7]
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