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  2. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Simplified diagram for electroplating copper (orange) on a conductive object (the cathode, "Me", gray). The electrolyte is a solution of copper sulfate, CuSO 4 in sulfuric acid. A copper anode is used to replenish the electrolyte with copper cations Cu 2+ as they are plated out at the cathode.

  3. Electrotyping - Wikipedia

    en.wikipedia.org/wiki/Electrotyping

    Schematic apparatus for electrotyping. An electric current flows from the battery, through the copper anode, the electrolyte, and the coated mold. A copper film (the electrotype) grows onto the electrically conducting coating of the mold. Electrotyping (also galvanoplasty) is a chemical method for forming metal parts that exactly reproduce a model.

  4. Copper electroplating - Wikipedia

    en.wikipedia.org/wiki/Copper_electroplating

    Copper plating on aluminium. Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [1]

  5. Nickel electroplating - Wikipedia

    en.wikipedia.org/wiki/Nickel_electroplating

    Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]

  6. Electrochemical machining - Wikipedia

    en.wikipedia.org/wiki/Electrochemical_machining

    Electrochemical machining (ECM) diagram. 1: Pump 2: Anode (workpiece) 3: Cathode (tool) 4: Electric current 5: Electrolyte 6: Electrons 7: Metal hydroxide. Electrochemical machining (ECM) is a method of removing metal by an electrochemical process.

  7. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    PCB via current capacity chart showing 1 mil plating via current capacity & resistance versus diameter on a 1.6 mm PCB. In printed circuit board (PCB) design, a via consists of two pads in corresponding positions on different copper layers of the board, that are electrically connected by a hole through the board.

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  9. LIGA - Wikipedia

    en.wikipedia.org/wiki/LIGA

    LIGA consists of three main processing steps: lithography, electroplating, and molding. There are two main LIGA-fabrication technologies, X-Ray LIGA, which uses X-rays produced by a synchrotron to create high-aspect-ratio structures, and UV LIGA, a more accessible method which uses ultraviolet light to create structures with relatively low aspect ratios.

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