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  2. Copper electroplating - Wikipedia

    en.wikipedia.org/wiki/Copper_electroplating

    Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [ 1 ]

  3. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Electroplating of acid gold on underlying copper- or nickel-plated circuits reduces contact resistance as well as surface hardness. Copper-plated areas of mild steel act as a mask if case-hardening of such areas are not desired. Tin-plated steel is chromium-plated to prevent dulling of the surface due to oxidation of tin.

  4. Chemical coloring of metals - Wikipedia

    en.wikipedia.org/wiki/Chemical_coloring_of_metals

    Black for copper. Solution of sodium polysulfide 2.5%, items must be submerged in the solution after color developing, wash, dry and wax or varnish colored object. [27] Brown for copper. Items are boiled in at least 3-day-old water solution of 12% copper sulfate, after color being developed, the material is washed, dried and waxed or varnished ...

  5. Copper plating - Wikipedia

    en.wikipedia.org/wiki/Copper_plating

    Copper plating may refer to: Copper electroplating , a technique of electroplating a layer of copper onto a metal object Electroless copper plating , an auto-catalytic chemical technique used to deposit a layer of copper on a solid workpiece

  6. Faraday's laws of electrolysis - Wikipedia

    en.wikipedia.org/wiki/Faraday's_laws_of_electrolysis

    Electroplating – a process where a thin layer of metal is deposited onto the surface of an object using an electric current; Electrochemical cells – generates electrical energy from chemical reactions; Electrotyping – a process used to create metal copies of designs by depositing metal onto a mold using electroplating

  7. Copper interconnects - Wikipedia

    en.wikipedia.org/wiki/Copper_interconnects

    For the Cu deposition (i.e. an additive manufacturing process), the IBM team in the late 1990’s selected electroplating. This started the ‘copper revolution” in the semiconductor / microchip industry. The copper plating starts with coating the walls of a via with a protective layer (Ta, TaN, SiN or SiC), that prevents Cu diffusion into ...

  8. Copper(II) sulfate - Wikipedia

    en.wikipedia.org/wiki/Copper(II)_sulfate

    Copper sulfate is commonly included in teenage chemistry sets and undergraduate experiments. [21] It is often used to grow crystals in schools and in Copper electroplating experiments despite its toxicity. Copper sulfate is often used to demonstrate an exothermic reaction, in which steel wool or magnesium ribbon is placed in an aqueous solution ...

  9. Luigi Valentino Brugnatelli - Wikipedia

    en.wikipedia.org/wiki/Luigi_Valentino_Brugnatelli

    In 1802, Brugnatelli successfully carried out the first gilding electroplating experiments [4] with the coating of carbon electrodes by a metallic film, finally refining the process in 1805 for which he used his colleague Volta's invention of five years earlier, the voltaic pile, to facilitate the first electrodeposition. He hypothesized that ...