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  2. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  3. Failure of electronic components - Wikipedia

    en.wikipedia.org/wiki/Failure_of_electronic...

    This occurs at accelerated life tests or high temperatures and is suspected to be caused by surface-state effects. Degradation in pinch-off voltage. This is a common failure mode for gallium arsenide devices operating at high temperature, and primarily stems from semiconductor-metal interactions and degradation of gate metal structures, with ...

  4. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Peltier cooling plates / ˈ p ɛ l t i. eɪ / take advantage of the Peltier effect to create a heat flux between the junction of two different conductors of electricity by applying an electric current. [9] This effect is commonly used for cooling electronic components and small instruments.

  5. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).

  6. Processor power dissipation - Wikipedia

    en.wikipedia.org/wiki/Processor_power_dissipation

    Processor power dissipation or processing unit power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits.

  7. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  8. Simu Liu claims he only had 5-minute warning before guest ...

    www.aol.com/simu-liu-claims-only-had-220221731.html

    Simu Liu stepped in as guest host for The Kelly Clarkson Show on Monday, but the Last Breath star claimed he only had a last-minute warning that he was taking over for Kelly Clarkson. "I do have a ...

  9. Overheating (electricity) - Wikipedia

    en.wikipedia.org/wiki/Overheating_(electricity)

    When overheating, the temperature of the part rises above the operating temperature. Overheating can take place: if heat is produced in more than expected amount (such as in cases of short-circuits, or applying more voltage than rated), or; if heat dissipation is poor, so that normally produced waste heat does not drain away properly.