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Semiconductor device fabrication. Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as RAM and Flash memory). It is a multiple-step photolithographic and physico-chemical process (with steps such as ...
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.
Computer-aided process planning. Computer-aided process planning (CAPP) is the use of computer technology to aid in the process planning of a part or product, in manufacturing. CAPP is the link between CAD and CAM in that it provides for the planning of the process to be used in producing a designed part. [1]
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the ...
Planar process. The planar process is a manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together. It is the primary process by which silicon integrated circuit chips are built, and it is the most commonly used method of producing junctions during the ...
During this time, a typical SMT assembly line employed two different types of pick-and-place (P&P) machines arranged in sequence. The unpopulated board was fed into a rapid placement machine. These machines, sometimes called chip shooters, place mainly low-precision, simple package components such as resistors and capacitors. These high-speed P ...
In the microelectronics industry, a semiconductor fabrication plant (commonly called a fab; sometimes foundry) is a factory for semiconductor device fabrication. [1] Fabs require many expensive devices to function. Estimates put the cost of building a new fab at over one billion U.S. dollars with values as high as $3–4 billion not being uncommon.
In computer engineering, instruction pipelining is a technique for implementing instruction-level parallelism within a single processor. Pipelining attempts to keep every part of the processor busy with some instruction by dividing incoming instructions into a series of sequential steps (the eponymous "pipeline") performed by different processor units with different parts of instructions ...