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A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
A 3D package (System in Package, Chip Stack MCM, etc.) contains two or more dies stacked vertically so that they occupy less space and/or have greater connectivity. An alternate type of 3D package can be found in IBM's Silicon Carrier Packaging Technology, where ICs are not stacked but a carrier substrate containing TSVs is used to connect ...
Pure memory stacking: two or more memory only packages are stacked on each other; Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard.
Yields: 4 servings. Prep Time: 5 mins. Total Time: 5 mins. Ingredients. 8 oz. citrus vodka. 4 oz. cranberry juice cocktail. 3 oz. fresh lime juice. 3 oz. triple sec ...
A System Requirements Specification (SysRS) (abbreviated SysRS to be distinct from a software requirements specification (SRS)) is a structured collection of information that embodies the requirements of a system. [1]
To be used efficiently, all computer software needs certain hardware components or other software resources to be present on a computer. [1] These prerequisites are known as (computer) system requirements and are often used as a guideline as opposed to an absolute rule. Most software defines two sets of system requirements: minimum and recommended.
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