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The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the package axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. [5]
A MCM containing four POWER5 dies and four 36 MB L3 cache dies. Measuring 3.75in x 3.75in Processor module from an IBM i5 system, containing a POWER5+ DCM 2 way POWER5 CPU, heat-sink removed (damaged CPU die) IBM POWER5+ 8-way MCM CPUs and cache chips. IBM POWER5+ 8-way MCM Interface. IBM POWER5+ 8-way MCM side view.
A ceramic multi-chip module containing four POWER5 processor dies (center) and four 36 MB L3 cache dies (periphery). A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying ...
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Pure memory stacking: two or more memory only packages are stacked on each other; Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard.
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