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  2. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Dual in-line (DIP) integrated circuit metal lead frame tape with contacts. Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the ...

  3. Tape-out - Wikipedia

    en.wikipedia.org/wiki/Tape-out

    In electronics and photonics design, tape-out or tapeout is the final stage of the design process for integrated circuits or printed circuit boards before they are sent for manufacturing. The tapeout is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility. The name originates from the ...

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.

  5. Integrated circuit layout - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_layout

    Layout view of a simple CMOS operational amplifier. In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit.

  6. Tape-automated bonding - Wikipedia

    en.wikipedia.org/wiki/Tape-automated_bonding

    Drawing of a tape-automated bonding carrier and definitions of various parts of the TAB assembly. Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.

  7. Integrated circuit design - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_design

    Engineer using an early IC-designing workstation to analyze a section of a circuit design cut on rubylith, circa 1979. Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs

  8. Chinese firm Fujian Jinhua cleared of US allegations that it ...

    www.aol.com/news/chinese-firm-fujian-jinhua...

    Fujian Jinhua Integrated Circuit Co Ltd was cleared on Tuesday of U.S. allegations that the Chinese chipmaker stole trade secrets, in a case that fanned tensions in an intensifying technology race ...

  9. Dual in-line package - Wikipedia

    en.wikipedia.org/wiki/Dual_in-line_package

    The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, [2] when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. [3]

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