Search results
Results from the WOW.Com Content Network
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm; Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced.
The major minus pitch technique also works for inch-based threads, but you must first calculate the pitch by converting the fraction of threads-per-inch (TPI) into a decimal. For example, a screw with a pitch of 1/20 in (20 threads per inch) has a pitch of 0.050 in and a 1 ⁄ 13 in pitch (13 threads per inch) has a pitch of 0.077 in.
VFBGA: very fine pitch ball grid array WFBGA : very very thin profile fine pitch ball grid array Effectively also the flip chip methods for mounting chip dies to a carrier is sort of a BGA design derivate with the functional equivalent of the balls there being called bumps or micro bumps.
Scientific pitch notation is often used to specify the range of an instrument. It provides an unambiguous means of identifying a note in terms of textual notation rather than frequency, while at the same time avoiding the transposition conventions that are used in writing the music for instruments such as the clarinet and guitar.
A sphere without bump mapping (left). A bump map to be applied to the sphere (middle). The sphere with the bump map applied (right) appears to have a mottled surface resembling an orange. Bump maps achieve this effect by changing how an illuminated surface reacts to light, without modifying the size or shape of the surface.