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The ECS-based A3000 also has 32-bit Chip RAM, but access is only 32-bit for CPU operations; the chipset remained 16-bit. The maximum amount of Chip RAM is dependent on the Agnus/Alice version. The original Agnus chip fitted to the A1000 and early A2000 systems is a 48-pin DIP package able to address 512 KiB of Chip RAM.
The AMD Radeon R9 290X (Sapphire OEM version pictured here) uses a 512-bit memory bus. The Intel Xeon Phi has a vector processing unit with 512-bit vector registers, each one holding sixteen 32-bit elements or eight 64-bit elements, and one instruction can operate on all these values in parallel. However, the Xeon Phi's vector processing unit ...
The S Duos 3 has a 1.0 GHz dual-core processor alongside the 512 MB RAM and 4 GB internal storage [3] (only 2.1 GB is user accessible). It has a 5 megapixel rear camera assisted with LED flash and a 0.3 megapixel (VGA) front-facing camera. The rear camera has 7 shooting modes and can record video in 720p.
The Pixel 7 is available in 128 or 256 GB of storage and 8 GB of RAM, and the Pixel 7 Pro is available in 128, 256, or 512 GB of storage and 12 GB of RAM. In addition to the second-generation Tensor chip, both phones are also equipped with the Titan M2 security module, along with an under-display optical fingerprint scanner , stereo speakers ...
As an example, a 512 MB SDRAM DIMM (which contains 512 MB), might be made of eight or nine SDRAM chips, each containing 512 Mbit of storage, and each one contributing 8 bits to the DIMM's 64- or 72-bit width. A typical 512 Mbit SDRAM chip internally contains four independent 16 MB memory banks. Each bank is an array of 8,192 rows of 16,384 bits ...
This works because the bit line input-drivers are designed to be much stronger than the relatively weak transistors in the cell itself so they can easily override the previous state of the cross-coupled inverters. In practice, access NMOS transistors M 5 and M 6 have to be stronger than either bottom NMOS (M 1, M 3) or top PMOS (M 2, M 4 ...
The number of chip ID bits remains at three bits, allowing up to eight stacked chips (3 → 3). A third bank group bit (BG2) was added, allowing up to eight bank groups (2 → 3). The maximum number of banks per bank group remains at four (2 → 2), The number of row address bits remains at 17, for a maximum of 128K rows (17 → 17).
Data lines and control connected in parallel to a 16-bit data bus, and only chip selects connected independently per channel. To two halves of a 32-bit wide data bus, and the control lines in parallel, including chip select. To two independent 16-bit wide data buses; Each die provides 4, 6, 8, 12, or 16 gigabits of memory, half to each channel ...