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Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
What they look like: Chiggers, a type of small mite, typically leave clusters of bites that are often very itchy. In many cases, chigger bites appear as small, red and itchy bumps. Sometimes, they ...
Keratosis pilaris (KP; also follicular keratosis, lichen pilaris, or colloquially chicken skin. [1]) is a common, autosomal-dominant, genetic condition of the skin's hair follicles characterized by the appearance of possibly itchy, small, gooseflesh-like bumps, with varying degrees of reddening or inflammation. [2]
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Rosacea is a chronic skin condition that causes redness, flushing, and small bumps on the face that may be pus-filled, swollen, tender, [and] acne-like, says Dr. Kamangar. The rash can occur ...
Cherry angioma, also called cherry hemangioma [1] or Campbell de Morgan Spot, [2] is a small bright red dome-shaped bump on the skin. [3] It ranges between 0.5 – 6 mm in diameter and usually several are present, typically on the chest and arms, and increasing in number with age.
Bumpless Build-up Layer (BBUL) is a processor packaging technology developed by Intel.It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires.